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Home arrow amd arrow AMD Regor and Callisto, the New X2s
AMD Regor and Callisto, the New X2s Print E-mail
Written by Michael Schuette   
May 29, 2009 at 09:25 PM

Athlon II X2 Processor Specifications

Model Number & Core Frequency:X2 250 = 3.0GHz
TRAY OPN# ADX250OCK23GQ
PIB OPN# ADX250OGQBOX
L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per processor)
L2 Cache Sizes: 1MB of L2 data cache per core (2MB total L2 per processor)
Memory Controller Type: Integrated 128-bit wide memory controller *
Memory Controller Speed: 2.0GHz with Dual Dynamic Power Management
Types of Memory Supported: Support for unregistered DIMMs up to PC2-6400 (DDR2-800MHz) -AND- PC3-8500 (DDR3-1066MHz)
HyperTransport 3.0 Specification:One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor-to-System Bandwidth:Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR3-1066) + 16.0GB/s (HT3)]
Up to 28.8GB/s bandwidth [Up to 12.8 GB/s total bandwidth (DDR2-800) + 16.0GB/s (HT3)]
Packaging:Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location:GLOBALFOUNDRIES Fab 1 Module 1
Process Technology:45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die Size:117.5 mm2
Approximate Transistor count: ~ 234 million
Max Case Temp: 74o Celsius
Core Voltage:0.85-1.425V
Max TDP: 65 Watt
*Note: configurable for dual 64-bit channels for simultaneous read/writes

Athlon II X2 die shot

Phenom II X2 Processor Specifications

Model Number & Core Frequency: X2 550 Black Edition = 3.1GHz
TRAY OPN#HDZ550WFK2DGI
PIB OPN# HDZ550WGIBOX
L1 Cache Sizes:64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per processor)
L2 Cache Sizes:512KB of L2 data cache per core (1MB total L2 per processor)
L3 Cache Size:6MB (shared)
Memory Controller Type:Integrated 128-bit wide memory controller *
Black Edition processors support software selectable increases to memory controller, HyperTransport, DDR3 and CPU core frequency.
Memory Controller Speed:2.0GHz with Dual Dynamic Power Management
Types of Memory Supported: Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0 Specification:One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor-to-System Bandwidth:Up to 37.3GB/s bandwidth [Up to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s (HT3)]
Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
Packaging:Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location:GLOBALFOUNDRIES Fab 1 Module 1
Process Technology:45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die Size:258 mm2
Approximate Transistor count: ~ 758 million
Max Case Temp:70o Celsius
Core Voltage:0.850-1.425V
Max TDP: 80 Watt

*Note: configurable for dual 64-bit channels for simultaneous read/writes



Last Updated ( Jul 17, 2009 at 02:22 AM )
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