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| HSDRAM, Hi-Speed DIMMs beyond PC133 The latest from Enhanced Memory Systems | |
| (Review by bighammer, edited by MS, March 27, 1999) |
Aside from the system bus speed, what are the other factors that decide over the quality and quantity of the data throughput. In the preview of the Enhanced Memory Systems upcoming ESDRAM we have analyzed some of the factors and I quote:
The easiest way of looking at DRAM memory is to use the analog of a spreadsheet organized into rows and columns of individual cells. Each cell consists of a capacitor that carries a charge that represent a bit of data. Moreover, a row of cells is connected via the data bit lines to transistors that function as sense amplifiers. Words are selected from the sense amplifiers to the output pins of the DIMM. There is typically one sense amplifier per memory column.
Now, one more time but with emphasis on timing issues:
Thus, all cycles involved in the release of one cache line fill of 4 words result in no less than 7 clock cycles (in the case of CAS Latency 2 DIMMs) before the next bank activate command can be issued. In the case of CAS Latency 3 DIMMs one has to add 3 cycles, one for the RAS to CAS delay, one for the CAS itself and one for the precharge to bring up the total number of cycles to 10.
So, what do these numbers tell us?
First of all, it is quite easy now to calculate the theoretical performance hit resulting from switching to less aggressive timing settings. That is, the time required for the transfer of a 4 word cache fill at 100 MHz will increase from 70 for CAS latency 2 (2:2:2) to 100 ns for CAS latency 3 (3:3:3) parts. This is not too bad, considering the prevailing price difference between CAS-2 and CAS-3 DIMMs.
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